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New Adapters Save Rework Costs New CSP Optical FA Test Sockets 2009 Representative-of-the-Year New Adapters Save Rework Costs by Enabling Use of Higher Pitch Devices on Smaller Pitch Boards Aries has expanded its line of Fine Pitch Bump Adapters to include adapters that accommodate boards with pitches down to 0.40mm. (read more) Aries Announces New CSP Optical FA Test Sockets for EMMI or Optical Sensor Applications The new CSP test socket has a window that optically exposes 100% of the top of the DUT (device under test) for FA (failure analysis) testing for EMMI (emission microscopy) or optical sensor applications. (read more) Aries Awarded Joe Midili of JMA, Inc. the 2009 Representative-of-the-Year Award After Nearly Doubling 2008 Sales With a 99% increase in sales over 2008, Midili outperformed other members of Aries' representative network for overall sales. Midili, owner JMA, Inc., has been working with Aries for nearly 14 years. (read more)
Aries Electronics is a leading manufacturer of a broad range of interconnect products and Correct-A-Chip™ technology. Our website contains over 150 full-spec Product Data Sheets available for viewing, downloading, and printing. We’ve created a source for electronic component design engineers to download technical Data Sheets with of variety of interconnect products for Test and Burn-in applications including... ZIF (Zero-Insertion-Force) Test Sockets for DIP, PGA, PLCC, and SOIC Devices Correct-A-Chip™ Product Line of “Intelligent Connectors” – incorporating Passive and Active Components Adapters – Connectors Using One Termination Style on Boards Designed for Different Styles BGA (Ball Grid Array) and LGA (Land Grid Array) Sockets High-Frequency (RF) Test and Burn-in Sockets

Aries Has Mastered These Manufacturing Processes... Installation of Pins into Plastic Molding Engineered Plastics with Tight Tolerances Crimping Connectors on Flat Cable Flat Cable Wire Stripping and Separation Custom High-Frequency (RF) Socket Design (-1dB Bandwidth at 10GHz) Surface-mounting of Electronic Components Bending Pins (Vertisocket™ Line) Patented Limited-Depth Pin Assembly Assembly of Solder Balls on Ceramic PC Boards and Connectors



	CEO Bill Sinclair and, from left manning the booth, Joe Midili, Paul Ruo and Roy Larsen represent Aries Electronics at the annual Semicon West in San Francisco, CA

Find Out What Aries is Doing about RoHS. RoHS Compliance Plan Download PDF Version		ISO 9001:2008 Approval
	Aries Electronics, Inc. is committed to RoHS compliance and will make every effort to assist our customers by making available as much information as possible. This information will continue to change as additional data becomes available.

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