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New Fine Pitch Bump Adapters Adapt BGA Devices of Any Pitch to 0.40mm Pitch Boards

 BRISTOL, PA – November 2009 – Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, has expanded the line of Fine Pitch Bump Adapters to include adapters that accommodate boards with pitches down to 0.40mm. As part of the Correct-A-Chip™ series, the new Fine Pitch Bump Adapters allow customers to use higher pitch devices on smaller pitch boards.

The adapter tops have landing pads that can be designed to accept any device on any pitch and easily settle into fine pitch footprints including Thin-Shrink Small Outline Packages (TSSOP) and Quad Flat Packages (QFP) with pitches down to 0.40mm. In addition, the adapter bottom has raised connection pads up to 0.010" (0.25mm) that provide easy mounting of the adapter to the target board.

Due to the open space now available on the top of the adapter board, manufacturers can easily add components to the design at a minimal cost. Fine Pitch Bump Adapters save users money by integrating higher pitch BGA devices with boards laid out with smaller pitches that typically could not be used together.

Fine Pitch Bump Adapter boards are 0.032" (0.813mm) thick FR4 or Rogers 370 HR, with 1/2-oz. copper traces on both sides. The non-solder mask defined (NSMD) pads are finished with electroless nickel immersion gold (ENIG). The apparatus can operate up to 221°F (105°C) for FR4 and 266°F (130°C) for lead-free.

The new adapters are available in tape and reel for high speed SMT assembly and can be manufactured for RoHS compliance. Standard line and trace spacing down to 0.003" (0.076mm) can be used.

Fine Pitch Bump Adapters are available in panelized form, as an adapter only, or as a turn-key solution with devices mounted. Aries specializes in custom design and production. In addition to standard products, special materials, platings, sizes and configurations can be furnished depending on quantity. For more information regarding an adapter to meet your needs, consult the Aries factory.

Pricing for the Fine Pitch Bump Adapters for a typical application starts at $15 per adapter in quantities of 100. Delivery is 3-4 weeks ARO.

For additional information, contact Aries Electronics, Inc., 2609 Bartram Road, Bristol, PA 19007-6810; Tel (215) 781-9956; Fax (215) 781-9845; Email: info@arieselec.com; Europe Email: europe@arieselec.com.

 

Select Previous Press Release... 09-2009 – New BGA Switch-A-Pitch™ Adapters Now Adapt 0.50mm Devices to 1.00mm Boards 08-2009 – New CSP Test Socket for Smaller Devices up to 13mm Square 07-2009 – New Switch-A-Pitch™ Adapters Provide Smaller Pitch Landing Pads on Larger Pitch Boards 06-2009 – Duerfeldt Engineering Offers Aries Electronics Connector Products in the Pacific Northwest 06-2009 – New Fine Pitch Bump Adapters Enable Use of Alternate ICs on PCBs Originally Designed for TSSOPs and QFP Packages 05-2009 – Adjustable Pressure Pad Enables Testing of Extremely Small and Fragile Devices without Damage 04-2009 – Aries Names Roy Larsen of Larsen Associates 2008 Representative of the Year 03-2009 – New Switch-A-Pitch™ Adapters Enable Use of Smaller Pitch Devices with More Cost-effective, Larger Pitch Boards 01-2009 – Aries Patented CSP/BallNest™ Hybrid Socket Provides Reliable, Consistent Test and Burn-in Down to 0.30mm Pitch