- BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides
- PINS: Brass 360 1/2-hard per UNS C36000 ASTM-B16-00
- PIN PLATING: Sn/Pb 93/7 per ASTM B 545 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290B
- OPERATING TEMPERATURE: 221°F [105°C]
SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia.
ALL DIMENSIONS: INCHES [MILLIMETERS]
ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED
“A” = NO. OF PINS PER ROW x 0.100 [2.54]
“D” = (NO. OF PINS PER ROW -1) x 0.100 [2.54]
AVAILABLE IN PANELIZED FORM WITH OR WITHOUT CUSTOMER-SUPPLIED DEVICES MOUNTED. CONSULT FACTORY.
CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS
PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED
CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. Special materials, platings, sizes, and configurations can be furnished, depending on quantity. NOTE: Aries reserves the right to change product specifications without notice.
P/N
|
Pins
|
Type
|
Dim. “B”
|
Centers “C”
|
Dim. “E”
|
Dim. “F”
|
Dim. “G”
|
Dim. “H”
|
14-35W000-10
|
14
|
SOIC
|
0.500 [12.7]
|
0.300 [7.62]
|
0.465 [11.81]
|
0.076 [1.93]
|
0.500 [12.70]
|
0.180 [4.57]
|
16-35W000-10
|
16
|
SOIC
|
0.500 [12.7]
|
0.30 [7.62]
|
0.465 [11.81]
|
0.076 [1.93]
|
0.550 [13.97]
|
0.180 [4.57]
|
18-35W000-10
|
18
|
SOIC
|
0.500 [12.7]
|
0.300 [7.62]
|
0.465 [11.81]
|
0.076 [1.93]
|
0.550 [13.97]
|
0.180 [4.57]
|
20-35W000-10
|
20
|
SOIC
|
0.500 [12.7]
|
0.300 [7.62]
|
0.465 [11.81]
|
0.076 [1.93]
|
0.550 [13.97]
|
0.180 [4.57]
|
24-35W000-10
|
24
|
SOIC
|
0.500 [12.7]
|
0.300 [7.62]
|
0.465 [11.81]
|
0.076 [1.93]
|
0.550 [13.97]
|
0.180 [4.57]
|
28-35W000-10
|
28
|
SOIC
|
0.500 [12.7]
|
0.300 [7.62]
|
0.465 [11.81]
|
0.076 [1.93]
|
0.550 [13.97]
|
0.180 [4.57]
|
We can provide you a quote for creating a custom product that fits all of your needs. Let us know exactly what you are looking for and we can make it!