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Allows for breadboarding or substitution of Microgate SOT-23A-6 and SOT-25 IC and transistor packages into 0.100 [2.54] pitch proto boards or PC boards

Solder masked top-side pads allow user to hand solder devices directly to topside of adapter with fewer problems of solder bridging

Longer male bottom Pins available at special request for easy use of probe clips

Large topside pads allow for soldering test pins, jumpers, etc. to top of adapter

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Specify

Pin Plating

Option

Clear

CONSULT FACTORY for mounting of consigned chips.

BOARD MATERIAL: 0.062 [1.58] thick FR-4 manufactured to IPC-600E, Class 2 standards, with 1-oz. Cu traces, both sides
PADS: HASL
PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
PIN PLATING: 200µ [5.08µ] Sn/Pb 93/7 ASTM B579-73 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290B
OPERATING TEMPERATURE: 221°F [105°C]

SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia.

ALL DIMENSIONS: INCHES [MILLIMETERS]

ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED

ALL CAC’s ARE MANUFACTURED ND INSPECTED USING IPC-610B CLASS 2 GUIDELINES

CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS

PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED

CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. Special materials, platings, sizes, and configurations can be furnished, depending on quantity. NOTE: Aries reserves the right to change product specifications without notice.

JEDEC Surface Mount-to-DIP SOT-25, SOT-23A-6 Adapter – P/N 1110748

FEATURES

Ordering information

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