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Posts by category
- Category: Latest News
- Aries Electronics Announces New Thermal Solutions for its Test and Burn-in Socket Line
- Aries Electronics Announces New Low-Cost, Quick-Delivery, Correct-A-Chip® IC Adapters
- Aries Electronics Announces Protect-A-Probe™ Anti-Diffusion Gold Coating Now Available for All Spring-Probes
- Aries Electronics Announces Probes on 0.2mm Pitch
- Aries Electronics Awarded “Best Presentation, Tutorial in Nature” at BiTS 2013
White Papers
- Cleaning Procedure for RF Microstrip Sockets
- IC Test Sockets Perform Beyond 10GHz
- BGA/CSP Socket Primer
- Reliability and Performance: Two Key Considerations in Evaluating High-Performance Test Sockets
- RF Conductive Elastomer Interconnect User's Guide for Board-to-DUT Applications
- RF Test Sockets: The Key to the Effective Testing of High-Frequency Devices
- RoHS Compliance Plan
- Setup Instructions for Universal SOIC Test Socket
- What You Can Expect from Aries Electronics
- IC Obsolescence
- Anatomy of a Test Socket
Products
- 14 to 28 Pins SOWIC-to-DIP Adapter – Series 35W000
- High-Temperature (250°C) Universal Zero-Insertion-Force DIP Test Socket – Series X55X
- CSP Test Socket for Optical Laser Failure Analysis w/ Emission Microscopy
- High-Frequency Center Probe Test Socket for Devices up to 6.5mm Square
- High-Frequency Center Probe Test Socket for Devices up to 55mm Square
- High-Frequency Center Probe Test Socket for Devices up to 40mm Square
- Machined High-Frequency Center Probe Test & Burn-in Socket for BGA, CSP, & MLF Packages
- High-Frequency Center Probe Test Socket for Devices up to 27mm Square
- High-Frequency Center Probe Test Socket w/Adjustable Pressure Pad for Devices up to 27mm Square
- High-Frequency Center Probe Test Socket for Devices up to 13mm Square
- High-Frequency Interposer Socket
- Long-Life Hi-Frequency Sockets for BGA, LGA, QFN, MLCC, µBGA and Bumped Die Devices
- High-Temp (up to 250°C) RF Test Socket with Replaceable Contact Strips
- RF Test Socket with Replaceable Contact Strips – Now Available in High-Temp 250°C Version
- 23027 Protect-A-Probe™ Anti-Diffusion Gold
- High-Temp Test & Burn-in Sockets for BGA, LGA, QFN, MLCC, and Bumped Die Devices
- Hi-Temp 200°C High-Frequency Interposer Test & Burn-In Sockets for BGA, LGA, QFN, MLCC, and Bumped Die Devices
- CSP Test Socket for Optical Laser Failure Analysis w/Emission Microscopy
- Kelvin Test Socket
- CSP/µBGA Test & Burn-In Socket for Devices Up to 6.5mm Square
- CSP/µBGA Test & Burn-In Socket for Devices up to 55mm Square
- CSP/µBGA Test & Burn-in Socket for Devices up to 40mm Square
- CSP/µBGA Test & Burn-in Socket for Devices from 14-27mm Square
- CSP/µBGA Test & Burn-in Socket w/Adjustable Pressure Pad for Devices up to 27mm Square
- CSP/µBGA Test & Burn-In Socket for Devices up to 13mm Square
- CSP Hybrid Socket
- DIP Extractor & DIP-R-SIZER™ Tools
- Programming Tools
- Strip Header/Socket Break Tool – P/N T-0600
- Low-Cost Quick Turn QFP Prototyping Adapters
- Low-Cost Small Outline Prototyping Adapter
- Test Socket Breakout Board
- Fine Pitch Bump Adapters for Use with 0.40mm Pitch Boards
- BGA Switch-A-Pitch Adapters
- Adapter for Aromat HB2E Relay w/SM Type TX2SA – P/N 08-305984-10, 08-305984-11 or 08-307472-10
- Adapter for Motorola MC145158-2 SOIC DW-to-20-Pin PLCC
- Replaces MAX691 with MAX807 – P/N 16-304235-10
- 68-Pin PLCC w/Die Flipped-to-68-Pin PGA for 87C196 IC and Others – P/N 68-304538-10
- SSOP-to-SOWIC Adapter
- 0.5mm 8- and 10-Pin MSOP-to-0.300" DIP Adapter – P/N 1111841-X
- 68-Pin PLCC-to-DIP 64-Pin Motorola MC68HC000 Adapter
- SOWIC-to-SOIC Adapter
- SOIC-to-SOWIC Adapter – P/N XX-666000-00
- JEDEC Surface Mount-to-DIP SOT-25, SOT-23A-6 Adapter – P/N 1110748
- TSOP-to-DIP Adapter on 0.600" [15.24mm] Centers – Series 655000
- 144-Pin VQFP-to-PGA Adapter – P/N 1110087
- SSOP-to-DIP Adapter – Series 651000
- SSOP-to-DIP Adapter
- PLCC-to-PGA JEDEC Adapter Type 0.050" [1.27mm] Pitch – Series 505
- Intel 80C31BH, 80C51BH, 87C51, 80/83C652, 80C251 and Other Microprocessors PLCC-to-DIP Adapter – P/N 1109342
- 132-Pin Amp Footprint PQFP-to-PGA Socket – P/N 97-AQ132D
- Motorola DSP56000/001 QFP-to-PGA Adapter – P/N 97-56001
- PLCC-to-DIP Adapter – Series 352000 and 353000
- PLCC-to-DIP Adapter – Series 652000 and 653000
- SOIC-to-JEDEC TO Adapter
- DIP-to-JEDEC TO Adapter/Socket – P/N 1109522 and 1109523
- SOIC and SOJ-to-DIP Adapter – Series 450001 and 650000
- SOIC and SOJ-to-DIP Adapter – Series 350000
- DIP-to-SOIC Adapter – Series 354000
- High-Temperature SOIC-to-DIP Adapter – Series 350000-10-HT
- Correct-A-Chip® Socket with Collet Contacts
- Shorting Plugs and Jacks on 0.040 [1.02] – Series SP200 & SJ200
- Thru-Hole Female DIP Strip on 0.040 [1.02] – Series F40
- Thru-Hole Male DIP Strip on 0.040 [1.02] – P/N 20-M40-11
- Program Header and Cover – Series 680
- DIP Programmable Headers – Series 675
- Program and Shorting Plug – Series LP300
- Miniature Jumper – Mini-Link™ Series ML-100
- Economy Miniature Jumper – Mini-Link™ Series ME-100
- Pin Grid Array Socket/Header on 0.100 [2.54] Centers w/Solder Pin Tails
- Inverter Socket – Series 6621
- Oscillator Socket – P/N 1107741 and 1108800
- Pin-Line™ Series 0517 Vertisocket
- Elevated Display Socket with Collet Contacts on 0.300 [7.62] and 0.600 [15.24] Centers – Series 8XXX
- Elevated Display Socket with Collect Contacts on 0.200 [5.08] Centers – Series 8XXX
- Elevated Display DIP Socket with Bifurcated Contacts – Series 8XXX
- Horizontal Mounting DIP Display with Collet Contacts – Series 800 Vertisocket
- Vertical Mounting with DIP Socket with Collet Contacts – Series 800 Vertisocket
- Economy Vertical Display DIP Socket with Bifurcated Contacts – Series 810 and 822
- Vertical Display DIP Socket with Bifurcated Contacts – Series 800
- Horizontal Display DIP Socket with Bifurcated Contacts – Series 800
- Pin-Line™ Header with Screw Machine Contacts – Series 0625
- DIP Header with Screw Machine Contacts – Series 625
- Strip-Line™ Header with Coined Contacts – Series 0600
- Header Covers – Series 650
- DIP Header with Coined Contacts – Series 600
- Row-to-Row DIP Adapter Socket – P/Ns 1106396 and 1107254
- Open-Frame Capacitor Collet DIP Socket with Wire Wrap Pins – Series 508
- Open Frame Capacitor Collet DIP Socket with Solder Pin Tails – Series 518
- EJECT-A-DIP™ Lock/Eject DIP Collet Socket with Wire Wrap Pins
- EJECT-A-DIP™ Lock/Eject DIP Collet Socket with Solder Pin Tails
- EJECT-A-DIP™ Lock/Eject DIP Collet Socket with Surface Mount Pins
- Single and Dual Row Wire Wrap Pins Collet Socket – Series 518
- Single and Dual Row Solder Pin Tails Collet Socket – Series 518
- Single and Dual Row Surface Mount Collet Socket – Series 518
- Open Frame Collet Surface Mount Socket – Series 518
- Open Frame Collet DIP Socket with Wire Wrap Pins – Series 508
- Open Frame Collet DIP Solder Pin Tail Socket – Series 518
- Pin-Line™ Collet Socket with Wire Wrap Pins – Series 0503
- Pin-Line™ Collet Socket with Solder Pin Tails – Series 0513
- Low-Profile Collet DIP Socket with Wire Wrap Pins – Series 503
- Low-Profile Collet DIP Socket with Solder Pin Tails – Series 513
- Elevator Strip-Line™ Socket with Bifurcated Contacts – Series 700
- Strip-Line™ Socket with Bifurcated Contact Wire Wrap Pins – Series 0501
- Strip-Line™ Socket with Bifurcated Contact Solder Pin Tails – Series 0511
- Standard DIP Test Socket with Wire Wrap Bifurcated Contacts – Series 501
- Standard DIP Test Socket with Bifurcated Solder Pin Contacts – Series 511
- 90° Pin-Staked Flex Jumper – Series 181 thru 183
- Yellow Streak SIP Jumpers on 0.100 [2.54] Centers – Series 154
- Inline Jumpers on 0.100 [2.54] Centers – Series 152, 156, and 157
- Male/Female DIP Jumpers – Series 200 thru 216
- Male/Female DIP Jumpers – Series 200 thru 216
- DIP Logic Jumper – Series 115, 116, and 117
- SIP Jumpers – Series 150 and 151
- DIP Jumpers – Series 112, 113, and 114
- DIP Jumpers – Series 112, 113, and 114
- DIP Jumpers – Series 100 thru 111
- Flat Pin-Staked Flex Jumpers – Series 171 thru 173
- Fusion Bonded Cable Jumpers – Series 152FB
- Quick-Release Universal ZIF DIP Test & Burn-in Socket – Series X57X
- Low-Profile ZIF DIP Test Socket – Series 526
- Zero-Insertion-Force DIP Test Socket – Series 516
- Universal SOIC-to-DIP 0.600 [15.24] Adapter – Series 647
- Universal SOIC ZIF Test Socket – Series 547
- Insert Plates for Universal PLCC ZIF Test Socket – Series 537
- Live Bug Type Universal PLCC ZIF Test Socket – Series 537
- PGA ZIF Test & Burn-in Socket for Any Footprint on Std 8x8 to 21x21 Grid
- Universal Test Socket Receptacle – Series 6556
- Universal ZIF DIP Test Socket – Series X55X
Galleries
Product categories
- Burn In & Test Sockets for SMT IC Devices
- Cable Assemblies
- Correct-A-Chip® Adapters
- DIP Jumpers
- DIP/SIP Headers & Covers
- DIP/SIP Sockets
- Fusion Bonded Cables
- High-Frequency (RF) IC Sockets
- High-Temp Sockets
- In-Line Jumpers
- LED/LCD Display Sockets
- Low-Cost Correct-A-Chip Adapters
- PCB & IC Adapters
- PGA & Other Sockets
- Production IC Sockets
- Programming Devices & Headers w/Covers
- Staked Flex Flat Conductor Cables
- Test, Burn-In and High Frequency RF Sockets for IC Devices
- Tools/Accessories
- ZIF Test Sockets for DIP, PGA, PLCC & SOIC Devices