Corporate History

Aries Electronics, incorporated in 1972, began when the late William “Bill” Sinclair purchased the back panel line from Thomas & Betts Corporation. The line included IC sockets, headers, and printed circuit cards. Under Bill’s vision, Aries expanded the line to encompass a wide variety of packaging products, including sockets, headers and covers, programmable devices and a variety of jumper and cable assemblies.

Aries has become established in the industry as a major source for unique connector products that solve a wide variety of packaging problems.

Aries is the recognized industry leader in ZIF (Zero-Insertion-Force) Test Sockets for DIP, PGA, PLCC, and SOIC devices, and continues to be a leading source for a wide variety of specialty electronic connectors.

In recent years, the company has made major inroads in the market for high-temperature sockets and flexible cable products. The addition of the Correct-A-Chip® product line established the company as a major source for “intelligent connectors” (incorporating other components, both passive and active), adapters (connectors that allow the use of one termination style on a board designed for a different termination style).

Most recently, the company has developed and patented several concepts for BGA (ball grid array) and LGA (land grid array) sockets, and has acquired a high-frequency test and burn-in socket line, furthering growth in the test socket market.

OEM Products

A wide variety of IC interconnection products for electronics applications, including several patented concepts for BGA (ball grid array) and LGA (land grid array) sockets; a full line of Test (high frequency >60 GHz) and Burn-in sockets for virtually any device, Correct-A-Chip® product line of “intelligent connectors” (incorporating other components, both passive and active), adapters (connectors that allow the use of one termination or signal routing style on a board designed for a different termination or signal routing style), and multi-chip modules (MCMs), including wire bonding capabilities; ZIF (Zero-Insertion-Force) test sockets for DIP, PGA, PLCC and SOIC devices; DIP, SIP and special purpose sockets, headers and covers; programmable devices; jumper and cable assemblies; flexible cable products; square pin connectors; and specialty electronic connectors.

Aries Success Results from Mastering Several Manufacturing Processes…

  • Custom High-Frequency (RF) Socket Design (-1dB Bandwidth at >60GHz)
  • Patented Limited-Depth Pin Assembly (Correct-A-Chip Adaptors)
  • Surface-mounting of Electronic Components onto adaptors
  • Molding Engineered Plastics with Extremely Tight Tolerances (for devices on <0.2mm pitch)
  • Bending Pins (Vertisocket™Line) LED/LCD applications
  • Installation of Pins into Plastic
  • Crimping Connectors on Flat Cable
  • Flat Cable Wire Stripping and Separation

Our corporate objective of continued growth within the electronic packaging area, further establishes our position as a major international connector manufacturer. Our target growth markets are additional ZIF Test Socket applications and further expansion of our Correct-A-Chip® capabilities, with particular emphasis in the area of pick-and-place.

Our marketing has been through manufacturers’ representatives and distributors throughout the United States and Canada; through European distributors reporting to our sales office in Holland, and through our authorized agents in the rest of the world.