EJECT-A-DIP™ Lock/Eject DIP Collet Socket with Surface Mount Pins

FEATURES

  • Eject-A-DIP™ is a rugged, solderable socket with a unique ejector/latch for fast in-field board maintenance
  • The latch locks in the connector or device, making it ideal for high vibration environments
  • The latch, when used as an ejector, removes DIP packages without pin damage
  • High-temperature 4/6 Nylon suitable for virtually any surface-mount soldering application

Ordering information

Clear

Consult Data Sheet 12024 and 12025 for other EJECT-A-DIP™ Collet Sockets.

  • LATCH AND BODY: black UL 94V-0 glass-filled 4/6 Nylon
  • PIN BODY: Brass 360 1/2-hard per UNS C36000 ASTM-B16-00
  • PIN BODY PLATING: either 10µ [0.25µ] min. Au per MIL-G-45204 or 200µ [5.08µ] min. 93/7 Sn/Pb per ASTM B545 or 200µ [5.08µ] min. Sn per ASTM B545 Type 1 over 100µ [2.54µ] min. Ni per SAE AMS-QQ-N-290B
  • 6-FINGER COLLET CONTACT: BeCu per UNS C17200 ASTM-B194-01
  • CONTACT PLATING: 10µ [0.25µ] min. Au per MIL-G-45204 over 50µ [1.27µ] min. Ni per SAE AMS-QQ-N-290B. Heavy 30µ [0.76µ] Au plating on contact also available
  • CONTACT CURRENT RATING: 3 amps
  • INSULATION RESISTANCE: 10,000 MΩ @ 500 VDC
  • WITHSTANDING VOLTAGE: 1000 V RMS
  • OPERATING TEMPERATURE: -67°F to 221°F [-55°C to 105°C] Sn plating, -67°F to 257°F [-55°C to 125°C] Au
  • INSERTION FORCE: 67g/pin, based on 0.018 [0.46] dia. test lead
  • WITHDRAWAL FORCE: 30g/pin, based on 0.018 [0.46] dia. test lead
  • NORMAL FORCE: 45g/pin, based on 0.018 [0.46] dia. test lead

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