PLCC-to-DIP Adapter – Series 352000 and 353000

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FEATURES

Converts PLCC packaged ICs-to-DIP footprints
Ideal for prototyping and testing/evaluation
Available with PLCC sockets or PLCC pads on top side
For Panelized Form or for mounting of consigned ICs.

ADAPTER BODY: 0.062 [1.58] thick, FR-4 with 1-oz. Cu traces
PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
PIN PLATING: Sn/Pb 93/7 per ASTM B579-73 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290B
OPTIONAL PLCC SOCKET: UL 94V-0 PPS
SOCKET CONTACTS: Phosphor Bronze
SOCKET CONTACT PLATING: 200µ [5.08µ] Sn/Pb 93/7 per ASTM B579-73 over 50µ [1.27µ] Ni per SAE AMS-QQ-290
CURRENT RATING: 1 amp
OPERATING TEMPERATURE: 221°F [105°C]

Download Data Sheet 18015

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Pins	Dim. “X”	Dim. “B”	Dim. “C”	Dim. “D”	Dim. “W” ±0.003 [0.08] non-cumulative	Dim. “X” ±0.003 [0.08] non-cumulative	Dim. “Y” ±0.003 [0.08]	Dim. “Z” ±0.003 [0.08]	Pad Size
20	1.100 [25.4]	0.900 [22.86]	0.500 [12.7]	0.500 [12.7]	0.200 [5.08]	0.200 [5.08]	0.350 \| [8.89]	0.350 [8.89]	0.024×0.076 [0.61×1.93]
28	1.400 [35.56]	1.300 [33.02]	0.705 [17.91]	0.705 [17.91]	0.300 [7.62]	0.300 [7.62]	0.549 [13.95]	0.449 [11.41]	0.024×0.076 [0.61×1.93]

PLCC-to-DIP Adapter – Series 352000 and 353000

FEATURES

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