Name: post_title
SKU: _sku
Price: _regular_price
Availability: _stock_status
Rating: none (none reviews)

FEATURES

Convert surface-mount PQFP packages to an Amp interstitial PGA footprint

Reduce costs by using less-expensive PQFP packages to replace PGA footprints in existing designs

Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact

For Panelized Form or for mounting of consigned chips. Consult Factory

RoHS version available, see Ordering Information

BODY MATERIAL: Tg170 FR-4, 0.062 [1.58] thick, with 1-oz. Cu traces
PADS: bare Cu protected with ENIG (Immersion Au over Electroless Ni) to eliminate coplanarity concerns and solder bridges associated with hot air solder leveling
PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
PIN PLATING: Sn/Pb 93/7 per ASTM B579-73 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290B –or – 10μ [0.254μ] Au per MIL-G-45204 over 100μ [2.54μ] Ni per SAE AMS-QQ-N-290 for RC version
OPERATING TEMPERATURE: 221°F [105°C]

132-Pin Amp Footprint PQFP-to-PGA Socket – P/N 97-AQ132D

FEATURES