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FEATURES

Convert surface-mount PQFP packages to an Amp interstitial PGA footprint

Reduce costs by using less-expensive PQFP packages to replace PGA footprints in existing designs

Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact

For Panelized Form or for mounting of consigned chips. Consult Factory

RoHS version available, see Ordering Information

BODY MATERIAL: Tg170 FR-4, 0.062 [1.58] thick, with 1-oz. Cu traces
PADS: bare Cu protected with ENIG (Immersion Au over Electroless Ni) to eliminate coplanarity concerns and solder bridges associated with hot air solder leveling
PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
PIN PLATING: Sn/Pb 93/7 per ASTM B579-73 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290B –or – 10μ [0.254μ] Au per MIL-G-45204 over 100μ [2.54μ] Ni per SAE AMS-QQ-N-290 for RC version
OPERATING TEMPERATURE: 221°F [105°C]

SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia.
Will plug into existing PGA footprint with matching pad assignments

ALL DIMENSIONS: INCHES [MILLIMETERS]

ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED

ROW-TO-ROW AND PIN-TO-PIN ±0.003 [±0.08] NON-CUMULATIVE
CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS

PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED

CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. Special materials, platings, sizes, and configurations can be furnished, depending on quantity. NOTE: Aries reserves the right to change product specifications without notice.

132-Pin Amp Footprint PQFP-to-PGA Socket – P/N 97-AQ132D

FEATURES

Ordering information

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