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JEDEC Surface Mount-to-DIP SOT-25, SOT-23A-6 Adapter – P/N 1110748

JEDEC Surface Mount to DIP

FEATURES

  • Allows for breadboarding or substitution of Microgate SOT-23A-6 and SOT-25 IC and transistor packages into 0.100 [2.54] pitch proto boards or PC boards
  • Solder masked top-side pads allow user to hand solder devices directly to topside of adapter with fewer problems of solder bridging
  • Longer male bottom Pins available at special request for easy use of probe clips
  • Large topside pads allow for soldering test pins, jumpers, etc. to top of adapter

Ordering information
Clear

CONSULT FACTORY for mounting of consigned chips.

  • BOARD MATERIAL: 0.062 [1.58] thick FR-4 manufactured to IPC-600E, Class 2 standards, with 1-oz. Cu traces, both sides
  • PADS: HASL
  • PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
  • PIN PLATING: 200µ [5.08µ] Sn/Pb 93/7 ASTM B579-73 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290B
  • OPERATING TEMPERATURE: 221°F [105°C]
  • SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia.

ALL DIMENSIONS: INCHES [MILLIMETERS]

ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED

ALL CAC’s ARE MANUFACTURED ND INSPECTED USING IPC-610B CLASS 2 GUIDELINES

CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS

PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED

CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. Special materials, platings, sizes, and configurations can be furnished, depending on quantity. NOTE: Aries reserves the right to change product specifications without notice.

Download Data Sheet 18043

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