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JEDEC Surface Mount-to-DIP SOT-25, SOT-23A-6 Adapter – P/N 1110748

JEDEC Surface Mount to DIP

FEATURES

  • Allows for breadboarding or substitution of Microgate SOT-23A-6 and SOT-25 IC and transistor packages into 0.100 [2.54] pitch proto boards or PC boards
  • Solder masked top-side pads allow user to hand solder devices directly to topside of adapter with fewer problems of solder bridging
  • Longer male bottom Pins available at special request for easy use of probe clips
  • Large topside pads allow for soldering test pins, jumpers, etc. to top of adapter

Ordering information
Clear

CONSULT FACTORY for mounting of consigned chips.

  • BOARD MATERIAL: 0.062 [1.58] thick FR-4 manufactured to IPC-600E, Class 2 standards, with 1-oz. Cu traces, both sides
  • PADS: HASL
  • PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
  • PIN PLATING: 200µ [5.08µ] Sn/Pb 93/7 ASTM B579-73 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290B
  • OPERATING TEMPERATURE: 221°F [105°C]
Download Data Sheet 18043

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