0.5mm 8- and 10-Pin MSOP-to-0.300″ DIP Adapter – P/N 1111841-X

FEATURES

  • A cost-effective means of upgrading to MSOP 0.5mm package SOIC without changing your PCB layout.
  • Available on 0.300 [7.62] centers

Ordering information

Clear
  • BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides
  • PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
  • PIN PLATING: 200µ [5.08µ] Sn/Pb 93/7 per ASTM B579-73 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290B
  • OPERATING TEMPERATURE: 221ºF [105ºC]

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