- BOARD MATERIAL: 0.062 [1.58] thick FR-4 or Rogers 370 HR, with 1/2-oz. Cu traces, both sides
- PADS: finished with ENIG (Electroless Ni Immersion Au), NSMD
- SOLDER SPHERES: 63/37 Sn/Pb or Lead-free SAC 305
- TRACE WIDTH/SPACE: 0.003 [0.0762]
- OPERATING TEMPERATURE: 221°F [105°C] FR-4, 266°F [130°C] Lead-free