CSP Hybrid Socket

FEATURES

• Aries unique universal socketing system allows the socket to be easily configured for any package, on any pitch (or multiple pitch) from 0.2mm or greater, in any configuration, with little or no tooling charge or extra lead-time.
• For Test & Burn-In of CSP, µBGA, Bump-Array, QFN, QFP, MLF, DFN, SSOP, TSSOP, TSOP, SOP, SOIC, LGA, LCC, PLCC, TO and any SMT package style made. Also can be compatible with PGA packaged devices.
• Quick and Easy Probe Replacement System: the complete set of probes can be removed and a new set (interposer) can be inserted quickly and easily. The old set can be returned to the factory for repair and sent back within one day.
• Socket lid nests device into socket for a reliable connection.
• ZIF style socket using Aries solderless, Au-plated pressure mount Spring-Probe.
• Special lid designs and/or materials can be quoted.
• Socket easily located, mounted & removed from PCB.
• Signal path during test only 0.077 [1.96].
• 4-point crown insures scrub on solder oxides – consult factory for other available probe styles.
• The Au over Ni-plated compression Spring-Probes leave very small witness marks on the bottom surface of the device solder balls.