CSP/µBGA Test & Burn-In Socket for Devices up to 13mm Square

FEATURES

• Aries unique universal socketing system allows the socket to be easily configured for any package, on any pitch (or multiple pitch) from 0.2mm or greater, in any configuration, with little or no tooling charge or extra lead-time.
• For Test & Burn-In of CSP, µBGA, Bump-Array, QFN, QFP, MLF, DFN, SSOP, TSSOP, TSOP, SOP, SOIC, LGA, LCC, PLCC, TO and any SMT package style made. Also can be compatible with PGA packaged devices.
• Quick and Easy Probe Replacement System: the complete set of probes can be removed and a new set (interposer) can be inserted quickly and easily. The old set can be returned to the factory for repair and sent back within one day.
• Sockets are easily mounted/removed to and from BIBs via solderless pressure mount compression spring-probes, accurately located with two molded plastic alignment pins mounted with four stainless steel screws.
• Au over Ni-plated compression spring-probe pins leave small witness marks on the bottom surface of the device contact points insuring solder oxide scrub for better electrical connections.
• Small socket profile allows maximum number of sockets per BIB and BIBs per oven, while being operator-friendly.
• Standard molded socket format can accommodate any device package of 13mm or smaller by using machined (for small quantities) or custom molded (for large quantities) pressure pads and interposers.
• Pressure pad compression spring provides proper force against device allowing for height variations in device thickness.
• Signal path during test only 0.077 [1.96].