CSP/µBGA Test & Burn-In Socket for Devices up to 55mm Square

FEATURES

• Aries unique universal socketing system allows the socket to be easily configured for any package, on any pitch (or multiple pitch) from 0.2mm or greater, in any configuration, with little or no tooling charge or extra lead-time.
• For Test & Burn-In of CSP, µBGA, Bump-Array, QFN, QFP, MLF, DFN, SSOP, TSSOP, TSOP, SOP, SOIC, LGA, LCC, PLCC, TO and any SMT package style made. Also can be compatible with PGA packaged devices.
• Quick and Easy Probe Replacement System: the complete set of probes can be removed and a new set (interposer) can be inserted quickly and easily. The old set can be returned to the factory for repair and sent back within one day.
• 4-point crown insures “scrub” on solder oxides.
• Single-point Probes available for small land area contact pads.
• Signal path during test only 0.077 [1.96].
• Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression Spring-Probes which, are accurately located by two molded plastic alignment pins and mounted with four stainless steel screws.
• The Au over Ni-plated compression Spring-Probes leave very small witness marks on the bottom surface of the device solder balls.
• Standard molded socket format can accommodate any device package of 55mm square or smaller.
• The spring-loaded, cam-actuated Pressure Pad applies proper force against the device after the lid is closed, latched and the cam is rotated to it’s detected location. Reversing the cam removes the force applied to the device prior to unlatching the spring loaded lid to it’s upright position.