CSP/µBGA Test & Burn-In Socket for Devices Up to 6.5mm Square

FEATURES

• Aries unique universal socketing system allows the socket to be easily configured for any package, on any pitch (or multiple pitch) from 0.2mm or greater, in any configuration, with little or no tooling charge or extra lead-time.
• For Test & Burn-In of CSP, µBGA, Bump-Array, QFN, QFP, MLF, DFN, SSOP, TSSOP, TSOP, SOP, SOIC, LGA, LCC, PLCC, TO and any SMT package style made. Also can be compatible with PGA packaged devices.
• Quick and Easy Probe Replacement System: the complete set of probes can be removed and a new set (interposer) can be inserted quickly and easily. The old set can be returned to the factory for repair and sent back within one day.
• Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression Spring-Probes which, are accurately located by two molded plastic alignment pins and mounted with two stainless steel screws.
• The Au over Ni-plated compression Spring-Probes leave very small witness marks on the bottom surface of the device solder balls.
• Small overall socket size/profile allows max. number of sockets per BIB and BIB’s per oven, while being operator friendly.
• Standard molded socket format can accommodate any device package of 6.5mm or smaller, by using machined (for small quantities) or custom molded (for large quantities) pressure pads and interposers.
• Pressure pad compression spring provides proper force against device and allows for height variations in device thickness.
• 4-point crown insures “scrub” on solder oxides.
• Signal path during test only 0.077 [1.96].