High-Frequency Center Probe Test Socket for Devices up to 27mm Square

FEATURES

• Aries unique universal socketing system allows the socket to be easily configured for any package, on any pitch (or multiple pitch) from 0.2mm or greater, in any configuration, with little or no tooling charge or extra lead-time.
• For Test & Burn-In of CSP, µBGA, Bump-Array, QFN, QFP, MLF, DFN, SSOP, TSSOP, TSOP, SOP, SOIC, LGA, LCC, PLCC, TO and any SMT package style made. Also can be compatible with PGA packaged devices.
• Quick and Easy Probe Replacement System: the complete set of probes can be removed and a new set (interposer) can be inserted quickly and easily. The old set can be returned to the factory for repair and sent back within one day.
• Pressure mounting, no soldering required.
• 4-point crown insures “scrub” on solder balls, raised tip provides “scrub” on pads.
• Signal path during test only 0.077 [1.96].
• Accommodates any package up to 27mm square.
• Small overall socket size/profile allows max. number of sockets per BIB and BIBs per oven, while being operator-friendly.