Name: post_title
SKU: _sku
Price: _regular_price
Availability: _stock_status
Rating: none (none reviews)

FEATURES

Pressure-mount plunge to board interposer

Multiple configurations: MLF, QFN, CSP, BGA, MSOP, QSOP, QFP, and more

Very low inductance per contact site

High cycle life with easy maintenance

Manual or Automated Handler applications

INSERTION LOSS: less than -1dB to 40GHz
SOCKET BODY MATERIAL: specified at time of quotation
INTERPOSER: etched Kapton with Au-plated Pads and Compliant Pads on bottom side
AVAILABLE PITCHES: down to 0.32mm
CONTACT SELF-INDUCTANCE: 0.11nH (0.50mm pitch CSP).
VSWR <2:1 to 40GHz
CONTACT RESISTANCE: <20mΩ
CONTACT FORCE: 15-25 grams
CURRENT CAPACITY: 2 amps (continuous) 4 amps (peak)
CONTACT LIFE: 50,000-100,000
SIGNAL PATH LENGTH: 0.011 (with compliant pads)
MUTUAL CAPACITANCE: 0.015pF
TEMPERATURE OPERATING RANGE: -40°C to 150°C

SUGGESTED PCB PADS: Au-plated
MOUNTING FORCE: 5-oz inches [0.035Nm]

ALL DIMENSIONS IN INCHES [MILLIMETERS]

CONSULT FACTORY FOR OTHER SIZES & CONFIGURATIONS

ALL TOLERANCES ±0.005 [±0.13] UNLESS OTHERWISE SPECIFIED

PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED

CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. Special materials, platings, sizes, and configurations can be furnished, depending on quantity. NOTE: Aries reserves the right to change product specifications without notice.

High-Frequency Interposer Socket

FEATURES

Ordering Information

Can’t Find What You're Looking For?