High-Frequency Interposer Socket

High Frequency Interposer Socket

FEATURES

Pressure-mount plunge to board interposer
Multiple configurations: MLF, QFN, CSP, BGA, MSOP, QSOP, QFP, and more
Very low inductance per contact site
High cycle life with easy maintenance
Manual or Automated Handler applications

INSERTION LOSS: less than -1dB to 40GHz
SOCKET BODY MATERIAL: specified at time of quotation
INTERPOSER: etched Kapton with Au-plated Pads and Compliant Pads on bottom side
AVAILABLE PITCHES: down to 0.32mm
CONTACT SELF-INDUCTANCE: 0.11nH (0.50mm pitch CSP).
VSWR <2:1 to 40GHz
CONTACT RESISTANCE: <20mΩ
CONTACT FORCE: 15-25 grams
CURRENT CAPACITY: 2 amps (continuous) 4 amps (peak)
CONTACT LIFE: 50,000-100,000
SIGNAL PATH LENGTH: 0.011 (with compliant pads)
MUTUAL CAPACITANCE: 0.015pF
TEMPERATURE OPERATING RANGE: -40°C to 150°C

Data Sheet 24007

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